SM2188EH 线性恒流产品系列

2023-04-25 发布
产品介绍
产品特点
产品应用
电路原理
管脚功能

产品介绍

SM2188EH,线性恒流产品系列封装图

SM2188EHPDF规格书

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SM2188EH开发应用方案

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SM2188EH 是一款无频闪、可满足新 ERP 标准的 LED 线性恒流控制芯片,内置过温保护功能,提升系统应用可靠性。外围可通过调节 REXT 电阻值对输出电流进行调节。同时 SM2188EH 集成了输入线电压补偿功能,在输入线高电压过时,按照外置的补偿电阻减小电解充电电流,以满足新 ERP 标准。 

其主要应用于 LED 照明、建筑亮化工程等领域,系统结构简单, 外围元件少,PCB 走线简洁,方案成本低。

产品特点

本司专利的恒流控制技术

  • 支持输入电压:120Vac/220Vac

  • 无频闪、可满足新 ERP 标准要求

  • 芯片间输出电流偏差<±5%

  • 无需磁性元器件可满足 EMI 应用

  • 具有过温调节功能

  • 封装形式:ESOP8

产品应用

T5/T8系列日光灯管LED芯片图片

LED 日光灯管 T5/T8

SM2082D单通道LED线性恒流控制芯片应用产品领域球泡灯图片

LED 球泡灯

LED 高压投光灯图片

投光灯

LED工矿灯图片

工矿灯

灯具类 LED 照明

应用电路图原理

典型方案

1. Adjust the output current value by changing the resistance value of R1; 

2. Adjust the electrolysis charging current by changing the resistance value of R2; R3 is the detection resistance of the system VT  pin, and the recommended value is 1M; 

3. The voltage drop of the light string is recommended to be 250~260V; 

4. To improve system reliability, RV1 is recommended to be retained.

PCB layout Attention

(1) IC substrate and PCB use solder paste process, to guarantee better touch of IC substrate and PCB. Red glue process is  prohibited on IC substrate. 

(2) Actual system output power is related to heat dissipation of PCB board and lamp shell, actual application power needs to match  heat dissipation condition. 

(3) Laying copper on IC substrate for heat dissipation and improve reliability. Copper laying is shown above, suggested substrate bonding pad size is 2.5mm*1.8mm. 

(4) Leakage of copper from IC substrate pad must keep at least 0.8mm away from the OUT port

引脚定义及功能详解

管脚说明

编号名称说明
1、2NCNo connection
3REXT1Output current setting port1
4REXT2Output current setting port2
5OUT2Power input and constant current output port 2
6VTConstant power setting port2
7NCConnect to ground when applied
8OUT1Power input and constant current output port 1
SubstrateGNDGround